DOWSIL™ 3-6635 Dielectric Gel One-part, heat cure, with low temperature (-80°C/-112°F) stability
Features & Benefits - 1-part gel with no mixing required
- Heat cure
- Suitable for very low temperatures (-80 to 200°C / 112 to 392°F)
- Less waste and potential for error with a 1-part material
- Gel remains flexible in very low temperature applications
- Low viscosity allows good flow under components
Application Methods- Manual or automated equipment