DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Two-part, 1 to 1 mix ratio, low viscosity encapsulant
Features & Benefits
- Soft, low durometer
- Low viscosity
- Room temperature or accelerated heat cure
- Good thermal conductivity
- Mix ratio 1 to 1
- Low internal stress during thermal cycling
- Highly flowable for filling small gaps and fast processing
- Good heat dissipation
- Prevents water ingress
- Electrically insulative
- Low total cost of ownership
- Approved for railways standard EN45545-2: R22/R23/R24/R25/R26 – HL3
Composition
- Two-part
- Polydimethylsiloxane
Applications
DOWSIL™ EE-3200 Low Stress Encapsulant has a very low hardness and viscosity to
minimize internal stress generation, fill small gaps, and improve manufacturing speed for
complex and high volume devices. Excellent flame resistance and protection against water
ingress that improve the safety and reliability under harsh outdoor environments such as:
- Power Conversion Devices (Inverters, Converters)
- Junction Boxes
- Automotive PCB Modules
- Railways PCB Systems Applications
