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DOWSIL™ EG-3896 KIT
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DOWSIL™ EG-3896 Kit
Suitable for potting and protecting of electronics devices, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.
Features & Benefits
Composition
Applications
DOWSIL™ EG-3896 Dielectric Gel is suitable for potting and protecting of PCB system assemblies, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.
Suitable for potting and protecting of electronics devices, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.
Features & Benefits
- Slightly hazy to clear
- Fast heat cure gel
- UL 94 V-1 flammability classification
- Suitable for operating temperatures ranging from -40°C to +185°C
- Improved resistance to crack formation
- Excellent flowability
Composition
- Two-part polydimethylsiloxane gel
Applications
DOWSIL™ EG-3896 Dielectric Gel is suitable for potting and protecting of PCB system assemblies, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.
