DOWSIL™ EG-3896 Kit Suitable for potting and protecting of electronics devices, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.
Features & Benefits
- Slightly hazy to clear
- Fast heat cure gel
- UL 94 V-1 flammability classification
- Suitable for operating temperatures ranging from -40°C to +185°C
- Improved resistance to crack formation
- Excellent flowability
Composition
- Two-part polydimethylsiloxane gel
Applications
DOWSIL™ EG-3896 Dielectric Gel is suitable for potting and protecting of PCB system assemblies, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric
insulation.
