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DOWSIL™ Q3-6575 DIELECTRIC GEL A/B KIT
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DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
Two-part, clear, RT or heat cure and low temperature (-80°C/-112°F)stability.
Features & Benefits
Two-part, clear, RT or heat cure and low temperature (-80°C/-112°F)stability.
Features & Benefits
- Fast heat cure
- Suitable for very low temperatures (-80 to 200°C / -112 to 392°F)
- Fast heat cure to speed processing
- Gel remains flexible in very low temperature applications
