DOWSIL™ X3-6211 Encapsulant
One-part, clear, UV cure. Features & Benefits
- UV cure gel with no mixing required
- Suitable for very low temperatures
- No mixing required
- UV curable for extremely fast processing speeds
- Gel remains flexible in very low temperature applications
DOWSIL™ X3-6211 Encapsulant is designed for very fast UV cure over relatively flat and less complicated circuit boards.