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DOWSIL™ X3-6211 ENCAPSULANT
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DOWSIL™ X3-6211 Encapsulant
One-part, clear, UV cure.
Features & Benefits
Composition
Applications
DOWSIL™ X3-6211 Encapsulant is designed for very fast UV cure over relatively flat and less complicated circuit boards.
One-part, clear, UV cure.
Features & Benefits
- One-part
- UV cure gel with no mixing required
- Suitable for very low temperatures
Composition
- No mixing required
- UV curable for extremely fast processing speeds
- Gel remains flexible in very low temperature applications
Applications
DOWSIL™ X3-6211 Encapsulant is designed for very fast UV cure over relatively flat and less complicated circuit boards.
