PERMABOND ES560 is a single-part epoxy adhesive
which flows when heated. It is unfilled and selflevelling,
making it particularly suitable for
electronics potting and encapsulation applications,
as well as underfilling and reworking microchips. It
has excellent thermal conductivity and shock
resistance.
Features & Benefits- Excellent adhesive strength
- Excellent resistance to vibration
- Easy to use – no mixing required
- Low viscosity
PropertiesShear strength (Steel): 14-20 N/mm²
Hardness: 80 Shore D
Viscosity: 1,000-3,000 mPa.s
max. gap fill: 0.1 mm
Cure speed 120°C: 40 min
Appearance: Cured – translucent
